Cleaning of inspectable plate heat exchangers not only involves the washing of plates but also requires dye penetrant test to verify there are no micro-crackings on plates and also the check of gaskets conditions.
Ongoing growth of liquid cooling and immersion cooling of data centers, with working temperatures allowing the use of free cooling, in order to face the increase in thermal design power of chips.
How to clean shell and tube heat exchangers, both in case of U pipes bundle exchangers, that can be extracted from the shell, and straight pipes shell and tube exchangers with mechanical cleaning or high pressure washing.
UK’s Department for Business & Trade announced the indefinite extension of CE marking recognition for machinery and products introduced within the Great Britain market, cutting red tape and creating certainty for firms.
Tempco is exhibiting with Microchannel Devices at Hydrogen Expo, 27-28 September in Bremen, presenting the innovative PCHE heat exchangers for hydrogen and fuel cells applications, realized using Diffusion Bonding technology.
Free flow plates with wide channels and no contact points in plate heat exchangers for use with dirty fluids such as in application for water cooling employed in plastics wire drawing for the production of plastic granules.
From heat exchangers to summer heat, Tempco wishes a Good August and a Cool Summer to everyone! See you in September!
Fouling Factor is a crucial element to evaluate for the sizing of plate heat exchangers upon the conditions of a certain thermal application, in order to ensure the best flow rate of the fluids inside the exchangers and maximizing the thermal transfer efficiency.
Cooling and thermal transfer system for the thermostatation of a reactor in a startup operating in the green chemistry field for the reuse of waste oil from the food sector to produce ester products to synthetize innovative solvents.
Special module for power electronics cooling using water in switch power rectifiers in the galvanic treatment sector, an accurate 3D study of the internal layout of the components allowed to realize a compact module for rack integration.
