Simple formula on how to calculate the volume of the thermal buffer tank in chillers, using four main data and informations including temperature of the cold water, temperature of the warm fluid, overall volume of the plant and estimated tank volume.
With the increasing use of natural refrigerants in industrial equipment against climate change it becomes even more important to carefully calculate the volume of brazed plate heat exchangers, taking into account a variety of factors.
Tempco Green Greetings for a Warm and Happy Christmas and a Sustainable New Year 2024 in the sign of even more Green Solutions in the field of thermal energy management and temperature regulation.
Thermal management Tempco solutions with PCHE plate heat exchangers for the hydrogen generation and use in fuel cells for the green energy industry and cooling of power electronics in zero emission yacht for the Baglietto Bzero project.
Air condensed dry cooler, as a more simple alternative to evaporative towers, and heat exchangers with stainless steel tubes ensure the proper cooling task in expanded polystyrene industrial production.
PCHE plate heat exchangers allow multistream design thanks to the special mechanical etching process employed to realize the channels, in addition to high and extreme pressure and temperature resistance thanks to diffusion bonding welding technology.
Tempco will participate at mcT Hydrogen, conference and exhibition on technologies for the production and use of hydrogen organized by EIOM fiere, in Milan on November 23.
Double standby exchangers systems with interconnect valves by Tempco for efficiency optimization in lubricating oil cooling in turbines employed for power generation ensuring maximum reliability.
Green energy transition application of PCHE heat exchangers by Tempco and Microchannel Devices for the cooling of high pressure compressed hydrogen featured in the new Hydrogen Guide 2024 by La Termotecnica.
Ongoing growth of liquid cooling and immersion cooling of data centers, with working temperatures allowing the use of free cooling, in order to face the increase in thermal design power of chips.
