PCHE exchangers (Printed circuit heat exchangers) are the key innovation that Tempco will present at the stand of our technological partner Microchannel Devices at the Hydrogen Expo in Bremen (Stand 5F120), the main European event dedicated to new technologies and solutions using hydrogen for a more sustainable future, that is going to be held on 27-28 September in Germany.

Tempco is exhibiting at Hydrogen Expo as a manufacturer to show visitors the great innovation represented by full inox PCHE exchangers, a new cutting-edge typology of heat exchangers that responds to the highly challenging needs of the emerging hydrogen industry., usually made in AISI 316L with the possibility to realize them also using titanium, aluminium and other special alloys.

Printed circuit exchangers can indeed handle extremely high pressures, up to 900 bar, and a wide temperature range from -250° C up to +400° C, and even further using some particular alloys, fulfilling the extreme conditions requirements of hydrogen applications and for cooling tasks in fuel cells. The outstanding performances are possible thanks to the special manufacturing process employed for PCHE exchangers, realized using the Diffusion bonding technology.

Diffusion bonding is a solid-state welding technique used in metalworking, capable of joining metal plates and accomplishing the welding by applying at the same time high pressure and high temperature. It therefore operates on the principle of solid-state diffusion, wherein the atoms of two solid, metallic surfaces intersperse themselves over time, creating in fact a unique object with no joints. The process allows to obtain heat exchangers with extraordinary structural integrity and more compact, 85% smaller and lighter than traditional heat exchangers. The technology also allows to realized highly customized heat exchangers, with very complex design of internal heat transfer channels obtained via chemical etching, ensuring extremely high thermal transfer coefficients and high efficiency for hydrogen applications.

Tempco is looking forward to welcome you next week with Microchannel Devices, Stand 5F120, at Hydrogen Expo, on September 27-28 in Bremen.